The Market for Thermal Management Technologies

The Market for Thermal Management Technologies. NEW YORK New York, state, United States New York, Middle Atlantic state of the United States. It is bordered by Vermont, Massachusetts, Connecticut, and the Atlantic Ocean E, New Jersey and Pennsylvania S, Lakes Erie and Ontario and the Canadian province of, Jan. 30, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:   The Market for Thermal Management Technologies    http://www.reportlinker.com/p096615/The-Market-for-Thermal-Management-Technologies.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor   REPORT SCOPE   INTRODUCTION   In recent years, there has been tremendous progress, technologically  and in terms of demand, in electronic devices and systems. The technological progress has come on two main fronts increased  functionality on a single device unit and miniaturization of each unit. Both of these developments have increased the need for thermal management technologies. "Thermal management" is the term used to describe the array of material technologies and problem-solving design tools that  systems manufacturers apply to regulate the unwanted heat caused by the  normal functioning of an electronic system. This report segments thermal management technologies into four segments hardware, software, interfaces and substrates. The hardware segment includes several product subsegments, including heat sinks, fans and blowers, fan sinks, heat pipes and cold plates. These segments were chosen because they are established technologies and represent revenue markets of significant size. The software segment consists of electronic design software designed to model and analyze the thermal characteristics of an electronic system  design. Specific types of thermal management software examined in this study include computational fluid design CFD CFD - Computational Fluid Dynamics, computational heat  transfer CHT CHT Chart  CHT Center for Health Transformation Washington, DC  CHT Chittagong Hill Tracts Bangladesh region  CHT Certified Hypnotherapist  CHT Cylinder Head Temperature  CHT Certified Hand Therapist , power management, circuit design and other electronic  design automation EDA 1 Electronic Design Automation Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board. .  Thermal management interface materials are products that stand  between a heat sink A material that absorbs heat. Typically made of aluminum, heat sinks are widely used in amplifiers and other electronic devices that build up heat. Small heat sinks are the most economical method for cooling microprocessors and other chips. and the device to be cooled, where their function is to improve the thermal transfer See thermal wax transfer printer and direct thermal printer. in the joint between the heat sink and the device to be cooled by increasing or securing the area of contact  between the two surfaces. In some cases, the interface actually performs the job of the heat sink. This role has become increasingly common in a number of applications in which, due to the height or weight constraints  of the system, a conventional hardware heat sink is not feasible. Finally, the report analyzes substrates, which are the foundations of integrated circuits ICs, or planar components of electronic  packages or modules. The report focuses on substrates that have been developed specifically to enhance the thermal handling capability of an  electronic component. STUDY GOAL AND OBJECTIVES  This report is an update of an earlier BCC Blind Carbon Copy The field in an e-mail header that names additional recipients for the message. It is similar to carbon copy cc, but the names do not appear in the recipient's message. Not all e-mail systems support the bcc feature. See fcc. Research report prepared in 2011. The overall goal of this updated report is to provide an analysis of the most recent developments and current trends in the  global thermal management marketplace. Specific objectives include:  -- Identifying thermal management technologies and products with the  greatest commercial potential in the near to mid-term 2012-2017. -- Analyzing the key drivers and constraints that will shape the market for thermal management technologies and products over the next  five years. -- Estimating the current and future demand for thermal management technologies and products. -- Ascertaining the companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances or other  advantages. INTENDED AUDIENCE  This report is intended especially for suppliers of thermal  management technologies and products, and others with a need to  understand the status and dynamics of the market for these products. Although the report is organized around specific technologies Find out more on  computer,